High Density Interconnect Be Made
The electronics industry is constantly seeking to pack more advanced technology into smaller packages. The challenge is to do this while still delivering excellent performance and quality. This is where high density interconnect (HDI) can help. Printed circuit boards (PCBs) designed using HDI practices are much thinner than traditional PCBs because they have smaller pads, vias, spaces, and traces. This means that more workings are packed into a smaller area and that the circuit board can be made with fewer layers.
There are different types of high density interconnect PCBs available and the choice will depend on your project’s design. Some are more complex than others, which will affect the cost and fabrication process. Some of the factors to consider are the number of layers and the type of vias and through-holes required.
Through-hole and blind vias are both used to create connections within the circuit board. The difference is that through-holes are drilled through the layers of the circuit board and are visible on one side. The holes are then plugged with a metal fill and plated to form the conductive connection. Blind vias are etched into the layers of the circuit board but are not visible on the front or back sides of the PCB. The resulting holes are then filled with copper and plated to form the conductive connection.
How Thin Can a High Density Interconnect Be Made?
Regardless of the type of vias used, they all help to facilitate tighter densities and reduce routing times. This can help to reduce the overall size of your PCB, which will make it smaller and less expensive. It also helps to increase the functionality of your PCB, which will allow you to include more components in a smaller space and thereby enhance the performance of your product.
In addition, HDI technology can improve your PCB’s impedance-controlled routing calculations and optimize thermal and signal integrity performance. The key to HDI PCB design is a carefully conceived layer stackup configuration before the layout begins. This will ensure that the traces and vias are positioned to achieve the desired results while maintaining a small finished PCB thickness.
The use of HDI PCB technology can be seen in a variety of consumer devices, including smartphones and tablets. The technology is also increasingly used in medical and aerospace equipment. For example, electronic devices for monitoring, imaging, surgical procedures, and laboratory analysis can incorporate HDI technology. It is also becoming more common in industrial equipment, such as machines for warehousing and manufacturing.
A HDI PCB is an excellent option for projects with tight space constraints, such as wearables, smartphones, tablet computers, and other portable devices. It can also be used in more sophisticated industrial applications, such as electronic sensors for warehousing and monitoring equipment. With HDI, a single PCB can replace several older, larger circuit boards in the same device. This will reduce the overall volume of the device, allowing it to be more portable and easier to use. It will also be more affordable and reliable.